TC News

The Image, Video, and Multidimensional Signal Processing Technical Committee (IVMSP TC) promotes and guides the advancement of the field of image, video, and multidimensional signal processing. It provides leadership for the technical programs for ICIP and for the IVMSP-related areas at ICASSP; recruits and volunteers reviewers for ICIP and for the IVMSP-related areas at ICASSP; assists in proposing and organizing ICIP; organizes and operates IVMSP workshops and sessions at ICIP and ICASSP; and participates in a range of other SPS activities.

The Design and Implementation of Signal Processing Systems Technical Committee (DISPS TC) has the mission to promote and support activities of the IEEE Signal Processing Society in the areas of: i) design, development and implementation of signal processing systems; ii) design of algorithms with implementation in mind and iii) design of software tools and methodologies to support the design of signal processing systems.

With the explosive growth of 5G wireless technology development, signal processing techniques are playing more and more important roles in many aspects. As an industry-oriented technical committee of the IEEE Signal Processing Society, Industry DSP Technology Standing Committee (IDSP-SC) is actively promoting 5G technology from a practice and industry perspective.

Several elections took place in the Sensor Array and Multichannel (SAM) technical committee (TC). We congratulate Peter Willett and Martin Haardt for their election and assignment as new SAM TC Chair and Vice-Chair, respectively. We especially thank our past SAM TC Chair Dominic K.C. Ho who was chairing the SAM TC in the past two years for his excellent leadership and dedication.