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Section: Publications & Resources

Nominations are due 31 January annually for the IEEE Technical Field Awards (TFAs). IEEE TFAs are awarded for contributions or leadership in a specific field of interest of the IEEE and are among the highest awards presented on behalf of the IEEE Board of Directors. All IEEE members are encouraged to submit a nomination for a worthy candidate within their technical fields.

Section: Community & Involvement

Technical Committee Members 

Section: Community & Involvement

Affiliates Contact Affiliates: sp-tc-mlsp-affiliates@ieee.org Contact Student Affiliates: sp-tc-mlsp-studentaffiliates@ieee.org-->

Section: Community & Involvement

Technical Committee   How to become a member The MLSP Technical Committee has three types of membership:

Section: Community & Involvement

Technical CommitteeWorkshopsWorkshops on Machine Learning for Signal ProcessingMLSP 2026, September 28-October 1, 2026, Atlanta, GA, USAMLSP 2025, August 31 - September 3, 2025, Istanbul, Turkey.MLSP 2024, September 22-25, 2024, London, UK.

Section: Community & Involvement

Technical Committee Resources IEEE Homepage IEEE Signal Processing Society Homepage LVA Central IEEE Neural Network Council Homepage IEEE Computer Society Homepage

Section: Community & Involvement

Technical Committee   Governance The technical committee consists of:

Section: Community & Involvement

Technical Committee ManagementChair: Fengqing Maggie ZhuPurdue University, School of Electrical and Computer EngineeringWest Lafayette, Indiana, USA

Section: Community & Involvement

Technical Committee Affiliates Contact Affiliates: sp-tc-mmsp-affiliates@ieee.org Contact Student Affiliates: sp-tc-mmsp-studentaffiliates@ieee.org-->

Section: Community & Involvement

.lead {font-size: var(--bs-body-font-size) !important;}Technical CommitteeSubcommitteesAwards SubcommitteeChair: Wen-Hsiao PengMembers: Ichiro Ide, Zhengguo Li, Fernando Pereira, Li Zhang