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Section: Publications & Resources
IEEE Fellow is the highest grade of membership of the IEEE. It honors members with an outstanding record of technical achievements, contributing importantly to the advancement or application of engineering, science and technology, and bringing significant value to society.
Section: Publications & Resources
Join the 25th IEEE International Conference on Image Processing (ICIP), held at the Megaron Athens International Conference Centre in Athens, Greece. ICIP is the world's largest and most comprehensive technical conference focused on image and video processing and computer vision.
Section: Publications & Resources
The 2018 IEEE Workshop on Statistical Signal Processing (SSP) will be held from 10-13 June 2018 in Freiburg, Germany. The SSP Workshop is a unique meeting that brings members of the IEEE Signal Processing Society together with researchers from allied fields such as bioinformatics,
Section: Publications & Resources
The rapid advancement and proliferation of information and communication technologies (ICT) in the past two decades significantly impacted how we do research. For instance, our research increasingly relies on growing computing power and storage capacity to gather and process the constant production of data - our observations of systems and phenomena we would like to understand, control, and improve.
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Section: Community & Involvement
The 2018 International Conference on Latent Variable Analysis and Signal Separation, LVA/ICA, will be the 14th in a series of interdisciplinary conferences which have attracted hundreds of researchers and practitioners over the years.
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Section: Community & Involvement
The 2018 IEEE Data Science Workshop is a new workshop that aims to bring together researchers in academia and industry to share the most recent and exciting advances in data science theory and applications.
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Section: Community & Involvement
Location: Hyderabad, Telangana, India
Paper Submission Deadline: 23 March 2018 (see call for other deadlines)
Event Date: 2-6 September 2018
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Section: Community & Involvement
Location: Melbourne, Australia
Submission Deadline: 14 January 2018
Event Date: 12-14 July 2018
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Section: Community & Involvement
Location: Hyderabad, Telangana, India
Submission Deadline: 1 December 2017
Event Date: 2-6 September 2018
Section: Publications & Resources
For our December 2017 issue, we cover recent patents granted in the area of applications of active contours.
