IEEE Signal Processing Systems Workshop (SiPS 2025) Convenes in Hong Kong
1–4 November 2025 | Hong Kong Polytechnic University
The 38th IEEE Signal Processing Systems (SiPS) Workshop brought together researchers, engineers, and industry leaders from around the world at the Hong Kong Polytechnic University for four days of discussion and discovery on the design, implementation, and application of signal processing systems.
Organized by the Applied Signal Processing Systems Technical Committee (ASPS TC) of the IEEE Signal Processing Society, and co-sponsored by the IEEE Circuits and Systems Society, SiPS remains one of the premier international forums exploring advances in system architectures, hardware accelerators, low-power edge devices, and AI-aided signal processing.
This year’s program featured more than 75 papers, four tutorials, and a lineup of five distinguished plenary speakers, including:
- Prof. Athina Petropulu (Rutgers University): Integrated Sensing Communication Systems in High Mobility Scenarios
 - Prof. Jie Chen (Fudan University / University of Alberta): From Minds to Molecules: How AI Builds Bidirectional Psychiatric Systems and Dynamic Virtual Cells
 - Prof. Jian Li (University of Florida): Design of Linear Sparse Arrays with Beampattern Shift-Invariant Properties
 - Prof. Manuel Delgado-Restituto (Instituto de Microelectrónica de Sevilla, CSIC–Universidad de Sevilla): Implanted Brain–Machine Interfaces for Motor Restoration and Speech Synthesis
 - Prof. Haizhou Li (The Chinese University of Hong Kong / National University of Singapore): Attentive Listening
 
An industry highlight of SiPS 2025 was the tutorial “Reasoning and Language Modeling Systems for Applied Signal Processing” presented by Dr. Huck Yang (NVIDIA Research), which explored how large language models are transforming practical signal processing workflows.
Session topics ranged from next-generation wireless networks and autonomous systems to audio and visual processing and hardware-efficient AI acceleration, underscoring SiPS’s growing role as a hub for collaboration between academia and industry.
With another successful workshop concluded, planning is already underway for SiPS 2026, which will take place in Bordeaux, France next November.
Those interested in joining the SiPS community or contributing to future editions can contact Brian Telfer, ASPS TC Chair, at telfer@ll.mit.edu.

