Members and Associate Members

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Audio and Acoustic Signal Processing

Membership

Chair: Sharon Gannot, Bar-Ilan University, Israel (Term Ends 12/31/18)

Vice Chair: Paris Smaragdis, University of Illinois at Urbana-Champaign, USA (Term Ends 12/31/18) 

Members: SP.TC.AUDIO@IEEE.ORG
Associate Members: sp-tc-audio-associates@ieee.org

TC Membership Nominations

Nominations to the Technical Committee on Audio and Acoustic Signal Processing are invited. If you wish to make any nominations please complete the TC Membership Nomination Form by September 15, 2018. Send the completed forms to Sharon Gannot (sharon.gannot@biu.ac.il)  (AASP TC chair).

Candidates can be self-nominated or nominated by Technical Committee members. Each nominee must confirm in writing his willingness to serve and perform the duties described in the Society Bylaws and Policies and Procedures. Each nominee must also submit a one-page position statement and vitae to be distributed before the election. Current and past TC members are eligible to be nominated for a second term. Additional terms are allowed, but at least a 3 year gap in service is required.

Members

Fabio Antonacci Politecnico di Milano, Italy 2019
Shoko Araki NTT, Japan 2019
Michael Brandstein MIT Lincoln Laboratory, USA 2019
Jingdong Chen Northwestern Polytechnical University, China 2019
Mads Græsbøll Christensen Aalborg University, Denmark 2020
Antoine Deleforge Inria Rennes-Bretagne Atlantique, France 2020
Simon Doclo University of Oldenburg, Germany 2019
  [Subcommittee Chair: EDICS]  
Dan Ellis Columbia University, NY, USA 2019
Christine Evers Imperial College, UK 2018
Tiago Falk University of Quebec, Canada 2020
Sharon Gannot Bar-Ilan University, Israel 2018
  [TC Chair], [Subcommittee Chair: Nominations and Elections]  
Timo Gerkmann University of Hamburg, Germany 2020
Hirokazu Kameoka NTT Communication Science Laboratories, Tokyo, Japan 2019
Minje Kim Indiana University Bloomington, USA 2020
Keisuke Kinoshita NTT Communication Science Laboratories, Japan 2020
Dorothea Kolossa Ruhr-University Bochum, Germany 2018
  [Subcommittee Chair: Publicity]  
Jonathan Le Roux Mitsubishi Electric Research Labs, USA 2019
Antoine Liutkus INRIA, France 2018
Michael Mandel Brooklyn College, NY, USA 2019
Nobutaka Ono National Institute of Informatics, Japan 2019
Alexey Ozerov Technicolor, France 2020
Hélène Papadopoulos CNRS, Laboratoire des Signaux et Systèmes,
Univ. Paris Saclay, France
2020
Bryan Pardo Northwestern University, USA 2018
Boaz Rafaely Ben-Gurion University of the Negev, Israel 2018
Jan Skoglund Google Research, CA, USA 2019
Paris Smaragdis University of Illinois at Urbana-Champaign, USA 2018
  [TC Vice Chair]  
Ann Spriet NXP Software, Belgium 2018
Zafar Rafii Gracnote, USA 2020
Ronen Talmon Technion - IIT, Israel 2020
Heinz Teutsch mh acoustics LLC, USA 2020
Tuomas Virtanen Tampere University, Finland 2018
  [Subcommittee Chair: Challenges]  
Mark Thomas Dolby Laboratories, USA 2020
Toon Van Waterschoot KU Leuven, Belgium 2018
Tao Zhang Starkey Hearing Technologies, USA 2020

 

Associate Members

Thushara Abhayapala Australian National University, Australia
Karlheinz Brandenburg Fraunhofer Institute, Germany
Israel Cohen Technion-IIT, Israel
Gary Elko mh acoustics, USA
Tomas Gaensler mh acoustics, USA
Michael Goodwin Audience, Inc., USA
Emanuël Habets University of Erlangen-Nuremberg, Germany
James Johnston Retired
Walter Kellermann University of Erlangen-Nuremberg, Germany
Shoji Makino University of Tsukuba, Japan
Rainer Martin Ruhr University Bochum, Germany
  [Subcommittee Chair: Fellows]
Dennis Morgan AT&T, USA
Meinard Mueller University of Erlangen, Germany
Gautham Mysore Adobe Research, USA
Tomohiro Nakatani NTT, Japan
Patrick Naylor Imperial College London, UK
Mark D. Plumbley University of Surrey,  UK
Gaël Richard TELECOM ParisTech, France
Hiroshi Sawada NTT, Japan
Gerald Schuller Ilmenau University, Germany
Malcolm Slaney Microsoft Research, USA
Akihiko (Ken) Sugiyama NEC, Japan
  [Subcommittee Chair: Industry Liaison]
Ivan Tashev Microsoft Research, USA
Vesa Välimäki Aalto University, Finland
Emmanuel Vincent INRIA, France
  [Subcommittee chair: Reviews]

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