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Audio and Acoustic Signal Processing

Technical Committee Members

Shoko ArakiChair: Shoko Araki
NTT Communication Science Laboratories
Kyoto, Japan
(Term Ends 12/31/24) 

 

 

Minje KimVice Chair: Minje Kim
University of Illinois at Urbana-Champaign
Urbana, IL, USA
(Term Ends 12/31/24)

 

 

TC Membership Nominations

Nominations to the Technical Committee on Audio and Acoustic Signal Processing are invited. If you wish to make any nominations please complete the TC Membership Nomination Form by September 15. Please send the completed forms together with a full CV to Emanuël Habets (emanuel DOT habets AT audiolabs-erlangen DOT de),  and to the AASP TC Chair Shoko Araki (shoko DOT araki DOT pu AT hco DOT ntt DOT co DOT jp).

We strongly encourage the experts from underrepresented social groups and regions to apply for our membership.

Candidates can be self-nominated or nominated by Technical Committee members. Nominees must confirm in writing their willingness to serve and perform the duties described in the Society Bylaws and Policies and Procedures. Each nominee must also submit a one-page position statement and vitae to be distributed before the election. Current and past TC members are eligible to be nominated for a second term. Additional terms are allowed, but at least a 3 year gap in service is required.

Members

Member Affiliation Term ends
Xavier Alameda-Pineda INRIA Grenoble Rhône-Alpes, France 2024
Shoko Araki NTT Communication Science Laboratories, Japan 2024
Emmanouil Benetos Queen Mary University of London, UK 2024
Rachel Bittner Spotify, USA 2026
Nicholas Bryan Adobe Research, USA 2025
Enzo De Sena University of Surrey, UK 2025
Lukas Drude Amazon, Inc., Germany 2025
Mounya Elhilali Johns Hopkins University, USA 2024
Magdalena Fuentes New York University, USA 2026
Francois G. Germain Mitsubishi Electric Research Labs, USA 2025
Daniele Giacobello Apple, CA, USA 2024
Emanuël Habets International Audio Laboratories Erlangen, Germany 2024
Reinhold Haeb-Umbach University of Paderborn, Germany 2024
Jesper Rindom Jensen Aalborg University Denmark  2024
Ante Jukic NVIDIA, USA 2026
Yohei Kawaguchi Hitachi, Ltd., Japan 2025
Minje Kim University of Illinois at Urbana-Champaign, USA 2024
Ina Kodrasi Idiap Research Institute, Martigny, Switzerland 2024
Simon Leglaive CentraleSupélec, IETR, France 2025
Annamaria Mesaros Tampere University, Finland 2024
Yuki Mitsufuji Sony R&D, Japan 2025
Pejman Mowlaee GN Audio A/S (Jabra), Denmark 2025
Ito Nobutaka The University of Tokyo, Japan 2025
Geoffroy Peeters Télécom Paris/ IP-Paris, France 2025
Mark Plumbley University of Surrey, UK 2026
Lin Wang Queen Mary University of London, UK 2025
Zong-Qiu Wang Carnagie Mellon University, USA 2025
Gordon Wichem Mitsubishi Electric Research Laboratory, USA 2025
Anurag Kumar Meta Reality Labs Research, USA 2026
Gongping Huang Wuhan University, China 2026
Juhan Nam Korea Advanced Institute of Science and Technology, South Korea 2026
Jun Du University of Science and Technology of China, China 2026
Justin Salamon Adobe Research, USA 2026
Mark Cartwright New Jersey Institute of Technology, USA 2026
Richard Hendriks TU Delft, The Netherlands 2026
Shoichi Koyama National Institute of Informatics, Japan 2026
Zhiyao Duan University of Rochester, USA 2026

 

Associate Members

Gaël Richard Télécom Paris, France
Paris Smaragdis University of Illinois at Urbana-Champaign, USA
Sharon Gannot Bar-Ilan University, Israel
Shoji Makino Waseda University, Japan
Ken Sugiyama Yahoo!, Japan
Walter Kellermann Friedrich-Alexander University, Germany
Michael M. Goodwin Amazon AWS, USA
Michael S. Brandstein  MIT Lincon Laboratories, USA

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