News from the IVMSP TC

by James E. Fowler (IVMSP TC Chair, 2012–2013)

The purpose of the Image, Video, and Multidimensional Signal Processing Technical Committee (IVMSP TC) is to promote and guide the advancement of the field of image, video, and multidimensional signal processing. The IVMSP TC provides leadership for the technical programs for ICIP and for the IVMSP-related areas at ICASSP; recruits and volunteers reviewers for ICIP and for the IVMSP-related areas at ICASSP; assists in proposing and organizing ICIP; organizes and operates IVMSP workshops and sessions at ICIP and ICASSP; solicits and endorses nominations for SPS Awards to the SPS Awards Board; solicits and endorses nominations for SPS Distinguished Lecturers; assists in recruiting associate editors for SPS publications; and participates in the development of IEEE standards.

After the successful renaissance of the IVMSP workshop in 2011, the TC is working toward its next workshop which will be on 3D Image/Video Technologies and Applications and will be held June 10–12, 2013, at Yonsei University in Seoul, South Korea. The workshop will continue the model of an intimate and focused interaction within a smaller group that was effectively employed in 2011. Thanks to Sanghoon Lee and Ioannis Pitas, General co-Chairs, as well as to the rest of the volunteers of the Organizing Committee for their efforts toward what we are sure will be a most rewarding workshop in 2013.

At its meeting at ICASSP 2013 (taking place May 26–31, 2013, in Vancouver, Canada), the TC will be reviewing proposals for ICIP 2018 and providing feedback on these to the SPS Conference Board. Proposals are due to SPS one month in advance of the conference; please contact Lisa Schwarzbek, Manager, SPS Conference Services, for information on proposal requirements and additional information.

The TC recently completed its annual cycle of elections and will be welcoming nine members who have been elected to the TC for a three year term starting January 2013 (in alphabetical order by last name): Homer H. Chen, National Taiwan University, Taipei, Taiwan; Frederic Dufaux, Telecom ParisTech, Paris, France; Adriana Dumitras, Microsoft/Skype, London, United Kingdom; Christine Guillemot, INRIA, Rennes, France; Onur Guleryuz, Futurewei Technologies, Inc., Santa Clara, California, USA; Pierre Moulin, University of Illinois, Urbana, Illinois, USA; Majid Rabbani, Eastman Kodak Company, Rochester, New York, USA; Peter Schelkens, Vrije Universiteit Brussel – iMinds, Brussels, Belgium; Anthony Vetro, Mitsubishi Electric Research Lab, Cambridge, Massachusetts, USA. Please join me in congratulating the incoming new members.

The TC welcomes participation from all members of the SPS technical community interested in the TC areas. Affiliate membership within the TC is open to all, and you are encouraged to sign up. Affiliate members receive TC-related announcements, participate in TC nominations processes, and are welcome to attend the open portions of the TC meetings at ICIP and ICASSP. For additional information, please visit the TC website.