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10 years of news and resources for members of the IEEE Signal Processing Society
IEEE has announced the recipients of the 2020 IEEE medals. IEEE medals are the highest honor of awards presented by IEEE. The medals will be presented at the 2020 IEEE Honors Ceremony. Three Signal Processing Society members have been awarded with IEEE medals for 2020:
The IEEE Jack S. Kilby Signal Processing Medal awarded for outstanding achievements in signal processing, will be presented to Ramalingam Chellappa “for contributions to image and video processing, especially applications to face recognition.”
The IEEE James H. Mulligan, Jr. Education Medal awarded for a career of outstanding contributions to education in the fields of interest of IEEE, will be presented to Leah Jamieson “for contributions to the promotion, innovation, and inclusivity of engineering education.”
The IEEE Dennis J. Picard Medal for Radar Technologies and Applications awarded for outstanding accomplishments in advancing the fields of radar technologies and their applications, will be presented to Joseph R. Guerci “for contributions to advanced, fully adaptive radar systems and real-time knowledge-aided, and cognitive radar processing architectures.”
IEEE TECHNICAL FIELD AWARDS
IEEE has announced the recipients of the 2020 IEEE Techinical Field Awards. IEEE Technical Field Awards are awarded for contributions or leadership in specific fields of interest of the IEEE. Three Signal Processing Society members have been awarded with IEEE Techinical Field Awards for 2020:
The IEEE James L. Flanagan Speech and Audio Processing Technical Field Award will be presented to Hynek Hermansky “for contributions to speech processing and feature extraction for robust speech recognition.”
The IEEE Fourier Award for Signal Processing will be presented to Alfred O. Hero, III “for contributions to the foundations of statistical signal processing with applications to distributed sensing and performance benchmarking.”
The IEEE Electronics Packaging Technology Award will be presented to Mitsumasa Koyanagi “for pioneering contributions leading to the commercialization of 3D wafer and die level stacking packaging.”
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