Technical Liaison Committee/Editorial Board

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    Technical Liaison Committee/Editorial Board

    Brendt Wohlberg Editor-in-Chief:
    Brendt Wohlberg
    Los Alamos National Laboratory, USA
    Email EIC
    Email SPS Publications Office
    Term Ends: 31 December 2021

     

     

    Technical Liaison Committee:

    Name Affiliation
    Peter Corcoran NUI Galway, Ireland
    Giampaolo Ferraioli Università degli Studi di Napoli Parthenope, Italy
    Clem Karl Boston University, USA
    Jong Chul Ye KAIST, South Korea

     

    Senior Area Editors:

    Name Affiliation
    Mujdat Cetin University of Rochester, USA
    Jeffrey Fessler University of Michigan, USA
    Orazio Gallo NVIDIA Research, USA
    Vivek K. Goyal Boston University, USA
    Stephen Mclaughlin Heriot-Watt University, UK
    James Theiler Los Alamos National Laboratory, USA

     

    Editorial Board:

    Name Affiliation
    Alin M. Achim University of Bristol, UK
    Fauzia Ahmad Temple University, USA
    Henry Arguello Industrial University of Santander, Colombia
    Petros T. Boufounos Mitsubishi Electric Research Laboratories, USA
    Gregery T. Buzzard Purdue University, USA
    Ilaria Catapano Institute for Electromagnetic Sensing of the Environment - National Research Council of Italy
    Stanley Chan Purdue University, USA
    Se Young Chun School of Electrical & Computer Engineering, Republic of Korea
    Carl Crawford Csuptwo, LLC, USA
    Michael Elad Israel Institute of Technology, Israel
    Mário A. T. Figueiredo Instituto de Telecomunicações, Portugal
    Alejandro F. Frangi University of Leeds, UK
    Jinwei Gu SenseTime Research (USA), USA
    Doga Gursoy Argonne National Laboratory, USA
    Diego Gutierrez Universidad de Zaragoza, Spain
    Justin Haldar University of Southern California, USA
    Matthias B. Hullin University of Bonn, Germany
    Ulugbek S. Kamilov Washington University in St. Louis, USA
    Min H. Kim KAIST School of Computing (Visual Computing Laboratory), South Korea
    Patrick La Riviere University of Chicago, USA
    Tobias Lasser Technical University of Munich, Germany
    Marco Martorella University of Pisa, Italy
    Hajime Nagahara Osaka University, Japan
    Chrysanthe Preza University of Memphis, USA
    Xiaobo Qu Xiamen University, China
    Ivan Selesnick New York University, USA
    Webster Stayman Johns Hopkins Department of Biomedical Engineering, USA
    Jinli Suo Tsinghua University, China
    Lei Tian Boston University, USA
    Ivana Tosic Google, LLC, USA
    Singanallur Venkatakrishnan Oak Ridge National Lab, USA
    Feng Yang Google Research, USA

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