Technical Liaison Committee/Editorial Board

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Technical Liaison Committee/Editorial Board

Brendt Wohlberg Editor-in-Chief:
Brendt Wohlberg
Los Alamos National Laboratory, USA
Email EIC
Email SPS Publications Office
Term Ends: 31 December 2021

 

 

Technical Liaison Committee:

Name Affiliation
Peter Corcoran NUI Galway, Ireland
Giampaolo Ferraioli Università degli Studi di Napoli Parthenope, Italy
Clem Karl Boston University, USA
Jong Chul Ye KAIST, South Korea

 

Senior Area Editors:

Name Affiliation
Mujdat Cetin University of Rochester, USA
Jeffrey Fessler University of Michigan, USA
Orazio Gallo NVIDIA Research, USA
Vivek K. Goyal Boston University, USA
Stephen Mclaughlin Heriot-Watt University, UK
James Theiler Los Alamos National Laboratory, USA

 

Editorial Board:

Name Affiliation
Alin M. Achim University of Bristol, UK
Fauzia Ahmad Temple University, USA
Henry Arguello Industrial University of Santander, Colombia
Petros T. Boufounos Mitsubishi Electric Research Laboratories, USA
Gregery T. Buzzard Purdue University, USA
Ilaria Catapano Institute for Electromagnetic Sensing of the Environment - National Research Council of Italy
Stanley Chan Purdue University, USA
Se Young Chun School of Electrical & Computer Engineering, Republic of Korea
Carl Crawford Csuptwo, LLC, USA
Michael Elad Israel Institute of Technology, Israel
Mário A. T. Figueiredo Instituto de Telecomunicações, Portugal
Alejandro F. Frangi University of Leeds, UK
Jinwei Gu SenseTime Research (USA), USA
Doga Gursoy Argonne National Laboratory, USA
Diego Gutierrez Universidad de Zaragoza, Spain
Justin Haldar University of Southern California, USA
Matthias B. Hullin University of Bonn, Germany
Ulugbek S. Kamilov Washington University in St. Louis, USA
Min H. Kim KAIST School of Computing (Visual Computing Laboratory), South Korea
Patrick La Riviere University of Chicago, USA
Tobias Lasser Technical University of Munich, Germany
Marco Martorella University of Pisa, Italy
Hajime Nagahara Osaka University, Japan
Chrysanthe Preza University of Memphis, USA
Xiaobo Qu Xiamen University, China
Ivan Selesnick New York University, USA
Webster Stayman Johns Hopkins Department of Biomedical Engineering, USA
Jinli Suo Tsinghua University, China
Lei Tian Boston University, USA
Ivana Tosic Google, LLC, USA
Singanallur Venkatakrishnan Oak Ridge National Lab, USA
Feng Yang Google Research, USA

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