Technical Liaison Committee/Editorial Board

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Technical Liaison Committee/Editorial Board

Müjdat Çetin Editor-in-Chief:
Müjdat Çetin
University of Rochester, USA
Email EIC
Email SPS Publications Office
Term Ends: 31 December 2024

 

 

 

Technical Liaison Committee

Name Affiliation
Peter Corcoran NUI Galway, Ireland
Giampaolo Ferraioli Università degli Studi di Napoli Parthenope, Italy
Clem Karl Boston University, USA
Jong Chul Ye KAIST, South Korea

 

Senior Area Editors

Name Affiliation
Fauzia Ahmad Temple University, USA
Stanley Chan Purdue University, USA
Carl R. Crawford Csuptwo, LLC, USA
Jeffrey Fessler University of Michigan, USA
Orazio Gallo NVIDIA Research, USA
Vivek K. Goyal Boston University, USA
Justin Haldar University of Southern California, USA
Stephen Mclaughlin Heriot-Watt University, UK

 

Associate Editors

Name Affiliation
Alin M. Achim University of Bristol, UK
Henry Arguello Universidad Industrial de Santander, Colombia
M. Salman Asif University of California, Riverside, USA
Petros T. Boufounos Mitsubishi Electric Research Laboratories, USA
Gregery T. Buzzard Purdue University, USA
Ilaria Catapano Institute for Electromagnetic Sensing of the Environment - National Research Council of Italy
Yang Chen Southeast University, China
Se Young Chun Seoul National University, Republic of Korea
Mauricio Delbracio Google, Inc., USA
Mariya Doneva Philips GmbH Innovative Technologies, Germany
Alejandro F. Frangi University of Leeds, UK
Elisa Giusti National Lab RaSS, CNIT, Italy
Jinwei Gu SenseTime Research (USA), USA
Doğa Gürsoy Argonne National Laboratory, USA
Ulugbek S. Kamilov Washington University in St. Louis, USA
Denis Kouame University of Toulouse III, Paul Sabatier, IRIT Lab, France
Patrick La Riviere University of Chicago, USA
Tobias Lasser Technical University of Munich, Germany
Marco Martorella University of Pisa, Italy
Chrysanthe Preza University of Memphis, USA
Xiaobo Qu Xiamen University, China
Ivan Selesnick New York University, USA
Jan Sijbers University of Antwerp, imec-Vision Lab, Belgium
Webster Stayman Johns Hopkins Department of Biomedical Engineering, USA
Jinli Suo Tsinghua University, China
Lei Tian Boston University, USA
Singanallur Venkatakrishnan Oak Ridge National Lab, USA
Feng Yang Google Research, USA
Bo Zhao University of Texas at Austin, USA

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