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Editorial Board

Dilek Hakkani-Tur Editor-in-Chief:
Dilek Hakkani-Tur
Amazon Alexa Al, USA
Email EiC
Email SPS Publications Office
Term Ends: 31 December 2021

 

 

 

Senior Area Editors

Name Affiliation
Michiel Bacchiani IBM TJ Watson Research Center, USA
Simon Doclo University of Oldenburg, Germany
Sharon Gannot Bar-Ilan University, Israel
Mark Hasegawa-Johnson University of Illinois, USA
Brian Kingsbury IBM T. J. Watson Research Center, USA
Yang Liu Amazon, USA
Giuseppe Riccardi University of Trento, Italy
Murat Saraclar Bogazici University, Turkey
Junichi Yamagishi National Institute of Informatics (NII), Japan

Associate Editors

Name Affiliation
Alberto Abad INESC-ID, Portugal
Tom Bäckström Aalto University, Finland
Mohit Bansal University of North Carolina at Chapel Hill, USA
Isabel Barbancho Universidad de Malaga, Spain
Stefan Bilbao University of Edinburgh, UK
Zoraida Callejas Carrion University of Granada, Spain
Stefania Cecchi Univeristy Politecnica delle, Italy
Nancy F. Chen Institute for Infocomm Research, Singapore
Jun Du University of Science and Technology of China, China
Christine Evers University of Southampton, UK
Eric Fosler-Lussier The Ohio State University, USA
Chuang Gan MIT-IBM Easton A1 Lab, China
Jianfeng Gao Microsoft Research, USA
Timo Gerkmann Universitat Hamburg, Germany
Juan Ignacio Godino-Llorente Universidad Politecnica de Madrid, Spain
Jing Huang JD AI Research, USA
Sachin Kajarekar SRI International, USA
Ozlem Kalinli Apple, USA
Keisuke Kinoshita NTT Communication Science Laboratories, NTT Corporation, Japan
Mathew Magimai Doss Idiap Research Institute, Switzerland
Hema A. Murthy Indian Institute of Technology Madras, India
Preslav Nakov Qatar Computing Research Institute, Qatar
Zhijian Ou Tsinghua University, China
Rohit Prabhavalkar Facebook, USA
Omid Sadjadi National Institute of Standards and Technology, USA
Sakriiani Sakti Nare Institute of Science and Technology, Japan
Romain Serizel Université de Lorraine, France
Zheng-Hua Tan Aalborg University, Denmark
Yu Tsao Information Technology Innovation, Academia Sinica, Taiwan
Wenwu Wang University of Surrey, UK
Lei Xie Northwestern Polytechnical University, China
Kai Yu Shanghai Jiao Tong University, China
Xiao-Lei Zhang Northwestern Polytechnical University, China

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