IEEE Transactions on Multimedia

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21 Jul

IEEE TMM Special Issue on Trustworthiness in Social Multimedia Analytics and Delivery

Manuscript Due: July 21, 2018
Publication Date: March 2019
CFP Document

01 Mar

TMM_SI.jpg

IEEE TMM Special Issue on Multimedia Big Data for Extreme Events

Manuscript Due: March 1, 2018
Publication Date: November 2018
CFP Document

05 May

IEEE TMM Special Issue on Video Analytics: Challenges, Algorithms, and Applications

Manuscript Due: May 5, 2017 [Extended]
Publicaton Date: Early 2018
CFP Document
 

08 May

TMM Special Issue - Visualization and Visual Analytics for Multimedia

Visualization and Visual Analytics for Multimedia
Manuscript Due: May 8, 2016
Publication Date: November 2016

Multimedia Prize Paper Award

The Multimedia Prize Paper Award is an annual award for an original paper in the field of multimedia published in the IEEE Transactions on Multimedia in the previous three calendar years. Authors of a single paper cannot receive the Multimedia Prize Paper Award in three consecutive years. The prize shall be a certificate and an honorarium of up to $500 per author. The total honorarium is not to exceed $1000. In the event that there are more than two authors, the maximum prize shall be divided equally among all authors and each shall receive a certificate.

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Steering Committee

Steering Committee
Yonggang Wen, EIC
Nanyang University of Technology
Singapore
Term Ends: 31 December 2025		 Max Mühlhäuser
Universität Darmstadt
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Editorial Board

Yonggang Wen Editor-in-Chief:
Yonggang Wen

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EDICS

 

EDICS Name Description
1 SIGNAL PROCESSING FOR MULTIMEDIA APPLICATIONS
1-ASLAS Audio/Speech/Language Analysis and Synthesis
1-COMP Low-complexity Processing in Devices and Sensors
1-CONV Media Conversion and Transcoding
1-CPRS Compression and Coding
1-DIST
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IEEE Transactions on Multimedia

The scope of the Periodical is the various aspects of research in multimedia technology and applications of multimedia, including, but not limited to, circuits, networking, signal processing, systems, software, and systems integration, as represented by the Fields of Interest of the sponsors.

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