Applied Signal Processing Systems
Technical Committee
Additional Resources
University Research Groups
- Berkeley Wireless Research Center, University of California, Berkeley, CA USA
- Center for Signal and Image Processing, Georgia Institute of Technology, Atlanta, GA USA
- Computer Aided Design Lab, Indian Institute of Science, Bangalore, India
- DSP/IC Design Lab, National Taiwan University, Taipei, Taiwan, R.O.C.
- Embedded Signal Processing Laboratory, The University of Texas at Austin, Austin, TX USA
- Integrated Systems for Information Processing Lab, McGill University, QC Canada
- Lab-STICC, Brittany, France
- Maryland DSPCAD Research Group, University of Maryland, MD USA
- Media IC and System Lab, National Taiwan University, Taipei, Taiwan, R.O.C.
- Multimedia Systems Laboratory, Seoul National University, Seoul, Korea
- Open RVC CAL compiler project, IETR/INSA Rennes, France, EPFL Switzerland
- Ptolemy Project, University of California, Berkeley, CA USA
- Spiral Project, Carnegie Mellon University, Pittsburgh, PA USA and ETH Zurich, Switzerland
- TTA-Based Co-design Environment Project, Tampere University of Technology, Finland
- VLSI Digital Signal Processing Lab, University of Minnesota, Minneapolis, MN USA
- VLSI Signal Processing Lab, National Chiao Tung University, Hsin-Chu, Taiwan, R.O.C.
- VLSI Signal Processing Research, Rice University, Houston, TX USA
Benchmarking Efforts
- BDTImark benchmark by Berkeley Design Technology Inc. (BDTI) is a benchmark of 11 assembly language kernels. The kernels are hand optimized and use only on-chip memory. They do test memory bandwidth.
- A complementary benchmarking effort tests the performance of the compiled C code. This benchmarking effort is by a consortium of more than 30 companies organized by Electronic Data News (EDN) called the EDN Embedded Microprocessor Benchmark Consortium. They have developed a variety of benchmarks for embedded processors (microcontrollers, DSPs, etc.) for different application spaces (automotive-industrial, consumer, office automation, networking and telecommunications).
Related Conferences Not Sponsored by this Technical Committee
