Activity Report from the IVMSP-TC

You are here

Inside Signal Processing Newsletter Home Page

Top Reasons to Join SPS Today!

1. IEEE Signal Processing Magazine
2. Signal Processing Digital Library*
3. Inside Signal Processing Newsletter
4. SPS Resource Center
5. Career advancement & recognition
6. Discounts on conferences and publications
7. Professional networking
8. Communities for students, young professionals, and women
9. Volunteer opportunities
10. Coming soon! PDH/CEU credits
Click here to learn more.

News and Resources for Members of the IEEE Signal Processing Society

Activity Report from the IVMSP-TC

Published in TC News on 1 March 2017

by Nikolaos Boulgouris

Image, Video, and Multidimensional Signal Processing Technical Committee (IVMSP TC) promotes and guides the advancement of the field of image, video, and multidimensional signal processing. It provides leadership for the technical programs for ICIP and for the IVMSP-related areas at ICASSP; recruits and volunteers reviewers for ICIP and for the IVMSP-related areas at ICASSP; assists in proposing and organizing ICIP; organizes and operates IVMSP workshops and sessions at ICIP and ICASSP; and participates in a range of other SPS activities.

During the past year, IVMSP TC has continued its key role in overseeing the organization, reviewing process and the technical program of the ICIP and ICASSP conferences, and provided core reviewing by volunteer TC members. ICIP 2016 was held in Phoenix, Arizona, USA, from September 25th to 28th and featured nine special sessions from diverse areas in image, video and multimedia signal processing, as well as an Innovation Program with prominent keynote Speakers. ICIP-2016 received over 2000 paper submissions and about 900 of them were accepted for presentation at the conference.

The TC’s 2016 flagship workshop took place in Bordeaux, France. The 12th IEEE Image, Video, and Multidimensional Signal Processing Workshop (IVMSP 2016) attracted a significant number of submissions and participants, who had the opportunity to attend very interesting talks, and exchange ideas about new trends in the field.

In January 2017, the TC has welcomed seven new members. Newly elected members for a three-year term (2017-2019) are, in alphabetical order: Yannick Berthoumieu (Bordeaux Institute of Technology, France), Mireille Boutin (Purdue University, US), Hsueh-Ming Hang (National Chiao Tung University, Taiwan), C.-C. Jay Kuo (University of Southern California, US), Tao Mei (Microsoft Research, China), Vishal Monga (Pennsylvania State University, US), Ivana Tosic (Ricoh Innovations, Corp, US). Congratulations to the new members!

The TC is also delighted to announce that, as of January 2017, Prof. James Fowler, current associate member and former chair of the TC, has been elevated to the IEEE Fellow grade. Prof. Fowler, from Mississippi State University, US, has been recognized for his contributions to lossy source coding and dimensionality reduction of multidimensional data. Congratulations!

IVMSP TC welcomes participation from all members of the SPS technical community interested in the TC areas. Affiliate membership within the TC is open to all, and you are encouraged to sign up. For additional information, please visit the TC website.

Table of Contents:

Chapter & DL News


IEEE SPS Educational Resources

IEEE SPS Resource Center

IEEE SPS YouTube Channel